Abstract-We report Al 2 O 3 Zln 0.53 Ga 0.47 As MOSFETs having both self-aligned in situ Mo source/drain ohmic contacts and self-aligned InAs source/drain n + regions formed by MBE regrowth. The device epitaxial dimensions are small, as is required for 22-nm gate length MOSFETs; a 5-nm In 0.53 Ga 0.47 As channel with an In 0.4 sAl 0.52 As back confinement layer and the n ++ source/drain junctions do not extend below the 5-nm channel. A device with 200-nm gate length showed I D = 0.95 mA/mum current density at V GS = 4.0 V and g m = 0.45 mS/mum peak transconductance at V DS = 2.0 V.